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Qualcomm has announced two new connectivity modules, which are designed to power the next generation of Internet of Things (IoT) devices. Specifically, the QCC730M and QCC74xM modules are poised to revolutionise smart homes, smart appliances, and industrial IoT applications. Furthermore, these advancements signal a significant leap forward in connectivity solutions,
Arm Cancels Qualcomm’s Chip Design Licence According to a Bloomberg News report, Arm Holdings, a leading semiconductor technology company, has announced it will terminate a licensing agreement with Qualcomm, a major chipmaker, amid an ongoing legal dispute. Arm cancelled its agreement allowing Qualcomm to use its intellectual property for chip
HUAWEI Kirin PC Chip: A Delayed Debut? According to a tipster on Weibo, HUAWEI may be pushing back the launch of its highly anticipated Kirin PC chip to the first quarter of 2025. This comes as a surprise to many who were expecting to see the brand’s first-ever computer-dedicated chip
AMD has announced plans to release the AMD Ryzen Z2 Extreme processor in early 2025. This powerful chip is designed to significantly enhance the performance and capabilities of handheld gaming devices. AMD Ryzen Z2 Extreme Key Features The Z2 Extreme builds on the success of its predecessor, the Ryzen Z1
Samsung Confirms Exynos 2500 SoC for Upcoming Flagships Samsung has officially confirmed the existence of its next-generation chipset, the Exynos 2500. The announcement came during the company’s Q2 financial results report, where it highlighted the chip’s crucial role in its upcoming product lineup. Set to be built on a cutting-edge
MediaTek has announced two new chips, the Dimensity 7300 and the Dimensity 7300X, designed to power the next generation of mobile devices. These 4nm chips offer best-in-class power efficiency and excellent performance, making them ideal for smartphones and other mobile devices. MediaTek Dimensity 7300: Power and Performance for Everyone Both
Samsung Electronics is making a bold move in the highly competitive chip market by initiating development of a 2 nanometer (nm) mobile application processor (AP). Codenamed “Thetis,” this chip utilises a cutting-edge technology not yet commercially available anywhere. The project positions Samsung as a serious contender in the global AP
Microsoft’s new Surface Laptop featuring the Snapdragon X Elite processor is generating buzz, with early benchmarks suggesting it can compete with Apple’s M2 chip. Snapdragon X Elite Early Results Show Promise Hardware enthusiast HXL shared benchmark results for the Surface Laptop 7 with the X Elite. While running CPU-Z on
Revolutionising Mobile Computing: Introducing Snapdragon X Plus Setting New Standards in CPU Performance Qualcomm Technologies, Inc. introduces the Snapdragon X Plus, featuring the state-of-the-art Qualcomm Oryon CPU. This custom-integrated processor delivers exceptional performance. It’s up to 37% faster than competitors’ CPUs. Moreover, it consumes up to 54% less power. This
Qualcomm has announced an upcoming launch event. It will be held on 18th March in China. This has sparked speculation about the release of their next generation chipsets. While details remain unconfirmed, rumours suggest the unveiling of the Snapdragon 7+ Gen 3 and Snapdragon 8s Gen 3. New chipsets from