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Qualcomm Reportedly Adopting Samsung’s “Heat Pass Block” Cooling for Next-Gen Flagship Chip TL;DR: Qualcomm is rumoured to be adopting Samsung’s “Heat Pass Block” (HPB) cooling technology for its next-gen flagship chips. This dedicated heat sink, used in the Exynos 2600, aims to reduce overheating and throttling seen in current Snapdragon 8
MediaTek Unveils Dimensity 9500 Flagship Chip After last week’s tease, MediaTek has officially announced its new flagship mobile platform, the MediaTek Dimensity 9500, a chipset designed for the next generation of 5G smartphones. The company states the new platform aims to improve performance, power efficiency, and on-device AI. The Dimensity
MediaTek’s Next Flagship SoC, the Dimensity 9500, to Launch on September 22 MediaTek is set to debut its next-generation flagship mobile chipset, the Dimensity 9500 SoC, in China on September 22, the company announced in a post on Weibo. The launch comes just one day ahead of rival Qualcomm’s Snapdragon
In a move that could significantly impact the performance and efficiency of future Pixel devices, reports indicate that Google has tapped Taiwan Semiconductor Manufacturing Company (TSMC) to manufacture its upcoming Tensor chipsets. Digitimes’ sources suggest that the Taiwanese foundry will produce the Tensor G5—expected to debut with the Pixel 10
Qualcomm Confirms Snapdragon 8 Elite 2 to Launch in September Qualcomm has officially confirmed the launch window for its highly anticipated next-generation flagship mobile system-on-a-chip (SoC), the Snapdragon 8 Elite 2. At their Computex 2025 keynote, the company announced that they will hold the next Snapdragon Summit in Hawaii from
“All Big Core” Powerhouse: MediaTek Unveils the Dimensity 9400e Flagship Chip MediaTek today announced the launch of its latest high-performance mobile chipset, the Dimensity 9400e, further expanding its portfolio of flagship-class processors. The new chipset features the company’s advanced “All Big Core” architecture, promising exceptional performance, energy efficiency, and enhanced
Snapdragon 8 Elite 2 Launch Window Revealed in New Leak Barely six months after Qualcomm introduced its powerful Snapdragon 8 Elite mobile platform in October 2024, whispers surrounding its successor, the Snapdragon 8 Elite 2, are already gaining traction. The latest buzz centres around a potential launch timeline for this
Xiaomi Intensifies In-House Chip Efforts with New ‘Chip Platform Department’ Xiaomi is reportedly taking significant strides towards its long-held ambition of developing custom silicon, having allegedly established a dedicated “chip platform department.” According to a report from Chinese tech publication ITHome, the internal announcement signals a deeper commitment from the
Xiaomi Custom Smartphone Chip Specs Leaked: TSMC N4P and Imagination GPU The smartphone landscape is bracing for another significant shift as details have emerged regarding Xiaomi’s foray into the world of in-house silicon. A recent leak has unveiled the specifications of the first custom-designed smartphone System on a Chip (SoC)
MediaTek has announced two new chips, the Dimensity 7300 and the Dimensity 7300X, designed to power the next generation of mobile devices. These 4nm chips offer best-in-class power efficiency and excellent performance, making them ideal for smartphones and other mobile devices. MediaTek Dimensity 7300: Power and Performance for Everyone Both