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In a move that could significantly impact the performance and efficiency of future Pixel devices, reports indicate that Google has tapped Taiwan Semiconductor Manufacturing Company (TSMC) to manufacture its upcoming Tensor chipsets. Digitimes’ sources suggest that the Taiwanese foundry will produce the Tensor G5—expected to debut with the Pixel 10
Qualcomm Confirms Snapdragon 8 Elite 2 to Launch in September Qualcomm has officially confirmed the launch window for its highly anticipated next-generation flagship mobile system-on-a-chip (SoC), the Snapdragon 8 Elite 2. At their Computex 2025 keynote, the company announced that they will hold the next Snapdragon Summit in Hawaii from
“All Big Core” Powerhouse: MediaTek Unveils the Dimensity 9400e Flagship Chip MediaTek today announced the launch of its latest high-performance mobile chipset, the Dimensity 9400e, further expanding its portfolio of flagship-class processors. The new chipset features the company’s advanced “All Big Core” architecture, promising exceptional performance, energy efficiency, and enhanced
Snapdragon 8 Elite 2 Launch Window Revealed in New Leak Barely six months after Qualcomm introduced its powerful Snapdragon 8 Elite mobile platform in October 2024, whispers surrounding its successor, the Snapdragon 8 Elite 2, are already gaining traction. The latest buzz centres around a potential launch timeline for this
Xiaomi Intensifies In-House Chip Efforts with New ‘Chip Platform Department’ Xiaomi is reportedly taking significant strides towards its long-held ambition of developing custom silicon, having allegedly established a dedicated “chip platform department.” According to a report from Chinese tech publication ITHome, the internal announcement signals a deeper commitment from the
Xiaomi Custom Smartphone Chip Specs Leaked: TSMC N4P and Imagination GPU The smartphone landscape is bracing for another significant shift as details have emerged regarding Xiaomi’s foray into the world of in-house silicon. A recent leak has unveiled the specifications of the first custom-designed smartphone System on a Chip (SoC)
MediaTek has announced two new chips, the Dimensity 7300 and the Dimensity 7300X, designed to power the next generation of mobile devices. These 4nm chips offer best-in-class power efficiency and excellent performance, making them ideal for smartphones and other mobile devices. MediaTek Dimensity 7300: Power and Performance for Everyone Both
Qualcomm has announced an upcoming launch event. It will be held on 18th March in China. This has sparked speculation about the release of their next generation chipsets. While details remain unconfirmed, rumours suggest the unveiling of the Snapdragon 7+ Gen 3 and Snapdragon 8s Gen 3. New chipsets from