Qualcomm Reportedly Adopting Samsung’s “Heat Pass Block” Cooling for Next-Gen Flagship Chip
TL;DR: Qualcomm is rumoured to be adopting Samsung’s “Heat Pass Block” (HPB) cooling technology for its next-gen flagship chips. This dedicated heat sink, used in the Exynos 2600, aims to reduce overheating and throttling seen in current Snapdragon 8 Elite Gen 5 devices without relying on battery-draining fans.
Qualcomm is reportedly planning to borrow a page from Samsung’s engineering playbook to address thermal challenges in its next-generation mobile processors. According to a new leak from tipster Fixed-Focus Digital on Weibo, the US chipmaker intends to implement a “Heat Pass Block” (HPB) on its upcoming flagship SoCs released later this year.
What is the Heat Pass Block?
The Heat Pass Block is a cooling solution originally developed by Samsung. It functions as a dedicated heat sink that sits directly atop the processor, significantly improving heat dissipation. This technology is already being employed in Samsung’s Exynos 2600, the chipset expected to power select models of the Galaxy S26 series.
If the report is true, Qualcomm’s adoption of this technology would mark a rare instance of the company leveraging a competitor’s proprietary innovation to enhance its own silicon.
Addressing Thermal Throttling
The move comes as high-end smartphones continue to push the thermal envelope. Recent devices powered by the current Snapdragon 8 Elite Gen 5, such as the POCO F8 Ultra, have faced criticism for high operating temperatures and significant performance throttling under load.
In contrast, the efficacy of Samsung’s cooling approach was highlighted in recent reports where the Exynos 2600 outperformed the Snapdragon 8 Elite Gen 5, demonstrating the clear advantages of superior thermal management.
While some manufacturers have resorted to active cooling fans to mitigate this, such solutions drain battery life and complicate the engineering required for IP-rated water and dust resistance. By integrating an HPB directly onto the chip, Qualcomm aims to provide a more passive, efficient cooling method that allows for sustained peak performance without the need for bulky external hardware.
